The quality of wafers is extremely important for effective fabrication of electronic circuits.

The Micro abrasive blasting can help in two important ways:

1. Surface Finishing: The SWAM® Abrading System by Crystal Mark finishes the surfaces
consistently with required precision.

Advantages of micro abrasive blasting:

a. Remove oxides and junctions.
b. Eliminate the backside damage for gettering, mesa diode processing as well as for
backlapping.
c. Reliable cleaning.

This technology can also be used for surface finishing, surface texturing as well as surface
preparation for a variety of different applications.

2. Wafer coring and contouring: Crystal Mark’s SWAM® C-5100 replaces all grinding
operations with one numerical, computer controlled, micro abrasive nozzle positioning
system. The micro abrasive blasting re-sizes the wafers without creating excessive
heating. Also, there is minimal effect from shock to the wafer. It is designed for Cutting
and Edge Rounding of silicon, silicon carbide, sapphire, Geranium, NaG, GaAs, and other
III-V materials as well as for Epi Crown Removal.

Advantages of our technology:

a. Precise work with guaranteed flat and/or notch in equivalent positions, This helps in
keeping the alignment of silicon grains.
b. Smooth edges that help in preserving the wafers. Sharp edges from other methods can
cause wafers to crack.
c. No crowning of wafer edges that limits effectiveness of wafer lines.
d. Protection from electrostatic discharge preserves the circuits/components built in the
silicon of the wafers.
e. Achieve dimensional tolerances up to +/- .002″.
f. Complete automatino and control that simplifies the wafer assembly lines.