Wafer Micro-machining and Coring

Crystal Mark’s micro abrasive blasting technology has the required precision and control to core all types of wafers as required by semi-conductor manufacturers, biomedical engineering companies as well as other applications.  Other  applications include etching patterns, features, fiducial targets, vias or through holes and pockets into all types of semi-conductor materials.

Wafer Micro-machining and Coring

Micro Abrasive Blasting Technology for MEMS

Crystal Mark has proven a track record of success in micromachining processes that selectively etch away parts of the wafer substrate. The technology is in use on a number of Micro-Electro-Mechanical Systems (MEMS) for integration of mechanical elements, sensors, and electronics for a wide range of applications. Crystal Mark customers are able to produce complex electrical, mechanical, thermal, optical mechanical, fluidic, magnetic structures and devices.

Crystal Mark’s consultative approach and a very systematic methodology to configure products to customer’s unique needs has made it possible for customers developing products for biomedical engineering or medicine as well as other biology applications.

Micro Abrasive Blasting Technology for MEMS

Wafer MEMS (3) Wafer MEMS (2)

Reclaiming Silicon Wafers – IP Protection

Customers are able to use micro abrasive blasting to remove the electronic circuits on the silicon wafer without damaging them. This not only helps customer’s protect their intellectual property, but also increases the reclaim value of the wafers for other applications such as pseudo square wafers for the solar industry.

Wafer IP Protection

For questions, please call us at toll free 800-659-7926 or 818-240-7520,
or email us at sales@crystalmarkinc.com