Silicon Micro-machining, MEMS

Wafer Micro-machining and Coring

Wafer Micro-machining and Coring


Crystal Mark’s micro-abrasive blasting technology has the required precision and control to core all types of wafers required by semi-conductor manufacturers and biomedical engineering companies. It also has other applications, including etching patterns, features, fiducial targets, vias, or holes and pockets into all types of semiconductor materials.

Micro Abrasive Blasting Technology for MEMS


Crystal Mark has proven a track record of success in micromachining processes that selectively etch away parts of the wafer substrate. The technology is in use on several Micro-Electro-Mechanical Systems (MEMS) to integrate mechanical elements, sensors, and electronics for a wide range of applications. Crystal Mark customers can produce complex electrical, mechanical, thermal, optical-mechanical, fluidic, magnetic structures, and devices.

Crystal Mark’s consultative approach and a very systematic methodology to configure products to the customer’s unique needs have made it possible for customers to develop products for biomedical engineering or medicine and other biology applications.

Wafer IP Protection

Reclaiming Silicon Wafers – IP Protection


Customers can use micro-abrasive blasting to remove the electronic circuits on the silicon wafer without damaging them. This helps customers protect their intellectual property and increases the reclaim value of the wafers for other applications such as pseudo square wafers for the solar industry.