20 Sep SWAM® Model B Edge Beveling Systems
The SWAM® Model B Edge Beveling Systems perform a multitude of precision cutting and beveling processes with exceptional consistency as well as with excellent repeatability on silicon, silicon carbide, sapphire, NaG, GaAs, GaP, glass, ceramic, Geranium, III-V materials, and other hard brittle materials. Unique processes include double positive beveling, simultaneous positive and negative beveling, reworking, grooving, and contouring as well as removing the epitaxial edge crown, cutting discs (outside diameter), and holes (inside diameter).
The Model B Systems include the Model LV-1 Micro Abrasive Blaster to deliver a consistent flow of abrasive powder through a sapphire nozzle. The nozzle is precisely positioned by a sealed slide assembly for pinpoint accuracy around the substrate which is secured in place by a rotary vacuum chuck. A timer is integrated to regulate the process period for split second accuracy. With the rotational concentricity of the chuck assembly and the accuracy of the abrading process, the cutting to a diameter tolerance of .001” is possible.
SWAM® Edge Beveling System Models
The SWAM Edge Beveling Systems are available in three different models with a variety of options that allow the user to meet production requirements and increase system capacity as the need arises.
The Model B1 is ideal for single-cut operations. Includes one Model LV-1 Micro Abrasive Blaster, a single nozzle setup, a set of four sapphire nozzles, a rotary vacuum chuck (25mm diameter standard size), and the nozzle positioning dial indicators.
The Model B1 can be upgraded to a Model B2 by adding a second Model LV-1 Micro Abrasive Blaster and another nozzle setup.
The Model B2 is designed for multi-angle wafer processing and by performing two operations simultaneously, precise concentricity is assured and operator productivity is significantly enhanced. The Model B2 includes two Model LV-1 Micro Abrasive Blasters, dual nozzle setup, a set of four sapphire nozzles, a rotary vacuum chuck (25mm diameter standard size), and the nozzle positioning dial indicators.
The Model B2-TV is also for multi-angle wafer processing with the incorporation of video equipment for monitoring. In addition to the components included with the Model B2, the B2-TV has an enclosed work area as well as a video system with an adjustable crosshair generator that permits the establishment of visual guidelines for each operation and a zoom lens assembly with a scratch-resistant lens cover.
|Specifications||Model B1||Model B2||Model B2-TV|
Chuck Spindle Speed
|Infinitely Adjustable: 5 to 400 RPM|
|Timer Range||1 second to 999 seconds (In 1 second increments)|
Maximum Part Size
|Size (approximate)||22”L x 22”W x 17”H*||30”L x 29”W x 29”H*|
|Weight (approximate)||65 pounds*||75 pounds*||150 pounds*|
|115VAC/60HZ/1PH/ 660 Watts|
|230VAC step down transformer provided for 220VAC/50HZ|
|Vacuum Requirement||1.5 SCFM at 25.4 10in Hg|
|Air Requirement||Clean, Dry air, Nitrogen or CO2 at 60 psi minimum|