Applications

Crystal Mark, Inc. has a track record for developing processes in electronics, aerospace, precision machining, medical manufacturing, semiconductor technology, glass engraving, fossil preparation, and more. In the case of large scale industrial applications, the company is able to use its vertical manufacturing capabilities for designing fully automated systems tailored to customer’s specific work environment.

Conformal Coating Removal

CCR-MAX-MV2L | Control ESD | Precision, Accuracy, Consistent Repeatability
CCR-MAX-MV2L | Control ESD | Precision, Accuracy, Consistent Repeatability for Conformal Coating Removal (CCR)

Deburring

Single Spindle Rotary Abrader System with LV-1 SWAM Blaster
Single Spindle Rotary Abrader System with LV-1 SWAM Blaster

Silicon Wafers Processing

C5100 Wafer Coring Edge Beveling System
C5100 Wafer Coring Edge Beveling System

Machining Applications

De-junking or Deflashing | Precision and Controllability
De-junking or Deflashing | Precision and Controllability

Silicon Micro-machining, MEMS

Micro Abrasive Blasting Technology for MEMS
Micro Abrasive Blasting Technology for MEMS

Manufacturing Mesa Diodes

Mesa Diodes Manufacturing | Microscopic Image - the top of the mesa 0.019” (482 microns) and the bottom is 0.027” (684 microns)
Mesa Diodes Manufacturing | Microscopic Image - the top of the mesa 0.019” (482 microns) and the bottom is 0.027” (684 microns)

Surface Finishing

Back Implant Close-up View: After Surface Finishing
Back Implant Close-up View: After Surface Finishing

Customers have options to choose from the broadest range of SWAM BLASTER® micro-abrasive processing units, ergonomic work chambers, fully integrated workstations, and work cells.