Applications

Crystal Mark, Inc. has a track record for developing processes in electronics, aerospace, precision machining, medical manufacturing, semiconductor technology, glass engraving, fossil preparation, and more. In the case of large scale industrial applications, the company is able to use its vertical manufacturing capabilities for designing fully automated systems tailored to customer’s specific work environment.


Conformal Coating Removal

CCR-MAX-MV2L | Control ESD | Precision, Accuracy, Consistent Repeatability
CCR-MAX-MV2L | Control ESD | Precision, Accuracy, Consistent Repeatability for Conformal Coating Removal (CCR)

Deburring

Single Spindle Rotary Abrader System with LV-1 SWAM Blaster
Single Spindle Rotary Abrader System with LV-1 SWAM Blaster

CONTROLLED EROSION

Controlled Erosion using Crystal Mark Micro Abrasive Processing
Selectively etch away substrate with unparalleled precision and accuracy using Crystal Mark Micro Abrasive Processing

Machining Applications

De-junking or Deflashing | Precision and Controllability
De-junking or Deflashing | Precision and Controllability

Silicon Wafer Coring

https://www.crystalmarkinc.com/wp-content/uploads/2017/08/wafer-coring-SWAM-C_5100-covers-open.jpg
SWAM C-5100 Wafer Coring, Contouring System | Work Area with Covers Open

Manufacturing Mesa Diodes

Mesa Diodes Manufacturing | Microscopic Image - the top of the mesa 0.019” (482 microns) and the bottom is 0.027” (684 microns)
Mesa Diodes Manufacturing | Microscopic Image - the top of the mesa 0.019” (482 microns) and the bottom is 0.027” (684 microns)

Surface Finishing

Back Implant Closeup View - AFTER
Back Implant Closeup View - AFTER

Customers have options to choose from the broadest range of SWAM BLASTER® micro-abrasive processing units, ergonomic work chambers, fully integrated workstations, and work cells.