Crystal Mark‘s SWAM® C-5100 replaces all grinding operations with one numerical, computer controlled, micro abrasive nozzle positioning system. The micro abrasive blasting resizes the wafers without creating excessive heating. Also, there is minimal effect from shock to the wafer. It is designed for Cutting and Edge Rounding of silicon, silicon carbide, sapphire, Geranium, NaG, GaAs, and other III-V materials as well as for Epi Crown Removal.
The SWAM® Abrading System by Crystal Mark finishes the surfaces consistently with required precision.
This technology can also be used for surface finishing, surface texturing as well as surface preparation for a variety of different applications.