Crystal Mark‘s SWAM® C-5100 replaces all grinding operations with one numerical, computer-controlled, micro-abrasive nozzle positioning system. The micro-abrasive blasting resizes the wafers without creating excessive heating. Also, there is a minimal effect from shock to the wafer. It is designed for Cutting and Edge Rounding of silicon, silicon carbide, sapphire, Geranium, NaG, GaAs, and other III-V materials, as well as for Epi Crown Removal.
The SWAM® Abrading System by Crystal Mark finishes the surfaces consistently with the required precision.
This technology can also be used for surface finishing, surface texturing, and surface preparation for a variety of different applications.