Crystal Mark has vertical manufacturing capabilities to design systems customized to meet unique requirements for each application.
Scroll down below to see examples of automated systems from Crystal Mark.
If you have a specific application where you would like to explore the feasibility of the micro abrasive process, you are welcome to submit form to request support. Our team will be in touch with you shortly.
The SWAM® Belt Abrading System precisely abrades uniform finishes to surfaces requiring exact repeatability. The process begins when substrates are loaded manually or automatically onto a conveyor belt. The belt then transports the substrates into the abrading area where one nozzle or up to as many as eight nozzles reciprocate up to 14” uniformly over the moving substrates. The substrates are fully supported by the perforated conveyor belt and held in place by the vacuum of the dust collector.
Crystal Mark has developed conveyorized abrading systems using belts that are 5”, 7”, 9”, or 16” wide.
The design can be adapted as required to integrate with the production environment.
Applications include surface texturing, selective etching, surface finishing or plating preparation of quartz, glass, ceramic, plastic, metals and many other materials requiring a uniform surface.
Crystal Mark has two different designs for rotary systems:
When long parts require complete coverage, a linear motion option can support one or more nozzles with either of these systems. The Crystal Mark team has extensive experience in customizing the solution as required for a customer’s specific application.
When consistency is demanded, these Abrading Systems are ideal for texturing or de-burring a variety of components including dental implants, titanium bone screws, implantable medical devices, as well micro machining/finishing/cleaning of components with sub-micron precision and accuracy.
Crystal Mark has extensive vertical manufacturing capabilities to design automated systems for the customer’s specific application requirements.
There are a number of automated systems that can be configured for range of applications such as conformal coating removal, surface finishing/cleaning applications, micro hole drilling, de-burring, cutting and routing.
Please specify your electrical requirements when requesting for a quote.
Crystal Mark is able to design new automated systems for nozzle positioning requirements.
The SWAM® Model C-5100 Wafer Coring and Contouring System is designed for cutting and edge-rounding of silicon, silicon carbide, sapphire, germanium, NaG, GaAs, and other III-V materials as well as Epi Crown Removal.
The SWAM C-5100 replaces all grinding operations with one numerical, computer controlled, micro abrasive nozzle positioning system. Due to the cool, shockless nature inherent in micro abrasive blasting, there is no stress, micro cracking or fracturing that occurs.
The result is a stronger semiconductor wafer, with less susceptibility to cracking, chipping or breakage.
The SWAM® Model B Edge Beveling Systems perform a multitude of precision cutting and beveling processes with exceptional consistency as well as with excellent repeatability on silicon, silicon carbide, sapphire, NaG, GaAs, GaP, glass, ceramic, Geranium, III-V materials, and other hard brittle materials. Unique processes include double positive beveling, simultaneous positive and negative beveling, reworking, grooving, and contouring as well as removing the epitaxial edge crown, cutting discs (outside diameter), and holes (inside diameter).