Edge Beveling Systems

Edge Beveling Systems

Item Number Model B1 Edge Beveling System

 

The SWAM Model B1 Edge Beveling Systems perform a multitude of precision cutting and beveling processes with exceptional consistency as well as with excellent repeatability on silicon, silicon carbide, sapphire, NaG, GaAs, GaP, glass, ceramic, Geranium, III-V materials, and other hard brittle materials. Unique processes include double positive beveling, simultaneous positive and negative beveling, reworking, grooving, and contouring as well as removing the epitaxial edge crown, cutting discs (outside diameter), and holes (inside diameter). The Model B1 Systems include a Model LV-1 Micro Sandblaster to deliver a consistent flow of abrasive powder through a sapphire nozzle. The nozzle is precisely positioned by a sealed slide assembly for pinpoint accuracy around the substrate which is secured in place by a rotary vacuum chuck. A timer is integrated to regulate the process period for split second accuracy. With the rotational concentricity of the chuck assembly and the accuracy of the abrading process, the cutting to a diameter tolerance of 0.001″ is possible. The Model B1 is ideal for single cut operations. Please specify the material type to be cut and your electrical requirements when requesting a quote. In addition to manufacturing micro sandblasting equipment, Crystal Mark, Inc. operates an on-site job shop for companies requiring micro sandblasting services.

Item Number Model B2 Edge Beveling System

 

The SWAM Model B2 Edge Beveling Systems perform a multitude of precision cutting and beveling processes with exceptional consistency as well as with excellent repeatability on silicon, silicon carbide, sapphire, NaG, GaAs, GaP, glass, ceramic, Geranium, III-V materials, and other hard brittle materials. Unique processes include double positive beveling, simultaneous positive and negative beveling, reworking, grooving, and contouring as well as removing the epitaxial edge crown, cutting discs (outside diameter), and holes (inside diameter). The Model B2 Systems include two (2) Model LV-1 Micro Sandblasters delivering a consistent flow of abrasive powder through a sapphire nozzle. The nozzles are precisely positioned by sealed slide assemblies for pinpoint accuracy around the substrate which is secured in place by a rotary vacuum chuck. Timers are integrated to regulate the process period for split second accuracy. With the rotational concentricity of the chuck assembly and the accuracy of the abrading process, the cutting to a diameter tolerance of 0.001″ is possible. The Model B2 is designed for multi angle wafer processing. Please specify the material type to be cut and your electrical requirements when requesting a quote. In addition to manufacturing micro sandblasting equipment, Crystal Mark, Inc. operates an on-site job shop for companies requiring micro sandblasting services.

Item Number Model B2-TV Edge Beveling System with Video System

 

The SWAM Model B2-TV Edge Beveling Systems perform a multitude of precision cutting and beveling processes with exceptional consistency as well as with excellent repeatability on silicon, silicon carbide, sapphire, NaG, GaAs, GaP, glass, ceramic, Geranium, III-V materials, and other hard brittle materials. Unique processes include double positive beveling, simultaneous positive and negative beveling, reworking, grooving, and contouring as well as removing the epitaxial edge crown, cutting discs (outside diameter), and holes (inside diameter). The Model B2-TV Systems include two (2) Model LV-1 Micro Sandblasters to deliver a consistent flow of abrasive powder through a sapphire nozzles. The nozzles are precisely positioned by sealed slide assemblies for pinpoint accuracy around the substrate which is secured in place by a rotary vacuum chuck. Timers are integrated to regulate the process period for split second accuracy. With the rotational concentricity of the chuck assembly and the accuracy of the abrading process, the cutting to a diameter tolerance of 0.001″ is possible. The Model B2-TV is for multi-angle wafer processing with the incorporation of video equipment for monitoring. Please specify the material type to be cut and your electrical requirements when requesting a quote. In addition to manufacturing micro sandblasting equipment, Crystal Mark, Inc. operates an on-site job shop for companies requiring micro sandblasting services.